Specifications ENTECH operates 2 thick film and 1 thin film laser trimming systems. All systems have a Step and Repeat Handler and can be equipped with Milli-Ohm, Giga-Ohm and Ultra- thin film options for special applications. Here are some technical details: Substrate size: 4" x 4" (standard), 6" x 6" (optional). Larger substrates can be processed upon request. Laser beam positioning accuracy: +/- 2.5µm. Handler positioning accuracy: +/- 6.35µm. Laser cut width (material dependent): thick film 25µm to 50µm (standard), thin film: 10µm to 20µm (standard). Scanner Matrix: 48 pins full Kelvin (extendable upon request). Measurement system accuracy (mid range): thick film +/- 0.035%, thin film +/- 0.02%. Measurement ranges (full Scale, system depending): 40 mΩ to 100 GΩ. IEEE und RS232c interface for functional trimming. Some of the above data are mean values and are application and system dependent.